About IC Packaging Courses


This series teaches you how to utilize Plastic Chip Encapsulation to simulate Chip Encapsulation process completelt and predict potential damage or corrosion before mass production, for instance, paddle deflection caused by pressure drop during the mold filling process, warpage in consideration of the correlation among IC components, resins, and their properties, to optimize mold design and process conditions.

  • Offerings: 73 short lessons
  • Key features: Learn the fundamentals and advanced topics of CAE analysis of IC Packaging.
  • Admission: Open enrollment
  • Fees: Short lessons online are free. Contact cloudservice@moldex3d.com for complete lessons or customized needs.


Course Details